Other Dies
MICRO RESEARCH is committed to satisfying the wide-ranging needs of customers by designing and producing a variety of products.
General precise stamping dies
We have much experience in design and production of semiconductor dies.
We have succeeded in the production of super high precision dies by fully understanding the requirements to handle semiconductor elements and their resin characteristics.
Molding dies
Recently, manufacturers have produced very small resin particles with a diameter of the order of micron. Therefore, very careful attention must be paid to avoid minute inaccuracies and resin leaks (burrs) when assembling dies.
Furthermore, mass production is a prime requirement, demanding us to manufacture parts with extremely high precision. Under these strict conditions, we will start mass production only after functional testing by test molds.
Trimming and forming dies
Press cutting dies always accompany a problem of "burrs" both at present and in the past. Ironically, dies need to maintain their sharpness to minimize the formation of burrs. Recently, as smaller and more high-precision products have been introduced to the markets, the parts for Kensaku Warigata (grinded split molds) need much higher precision than before.
To minimize the amount of burrs and extend the service life of dies, we face many challenges such as the form of a die. However, the most important points are to maintain a proper clearance between the punch and the die as well as to provide easy replacement of existing parts with spare ones.
